There are many ways to solve the EMI problem. Modern EMI suppression methods include: using EMI suppression coating, selecting appropriate EMI suppression parts and EMI simulation design. This article starts with basic PCB layout and discusses the role and design techniques of PCB layer stacking in controlling EMI emissions.

PCB printed circuit board design output and parasitic capacitance of vias, parasitic inductance of vias and vias in high-speed PCB, related issues of drilling design costs.

What is the significance of PCB impedance for PCB circuit boards, and why do PCB circuit boards need impedance? This article first introduces what impedance and the type of impedance are, secondly introduces why the PCB circuit board needs to be impedance, and finally expounds the meaning of impedance to the PCB circuit board. Follow us to learn more about it.

In the whole production process, there are many control points, if a little carelessness, the board will be broken, and the quality problems of PCB circuit boards are endless, which is also a headache, because only one of them has problem, then most of the devices will also fail to use.

Do you know why the PCB must be baked before SMT can pass through the reflow oven after it expires and exceeds the shelf life? The main purpose of PCB baking is to dehumidify and dehumidify, and to remove the moisture contained in the PCB or absorbed from the outside world, because some materials used in the PCB itself are easy to form water molecules.

Fifteen Common PCB Soldering Problems: Poor Solder Bridge Solder Joints, Over Soldering, Solder Balls, Cold Seams, Overheating Joints, Tombstoning, Insufficient Moisture, Solder Funnels, Raised Pads, No Solder Joints, Solder Spatter , pin holes and air holes, solder marks, solder balls, solder discoloration。

Consider design factors during the PCB design phase. While manufacturing factors are equally important, these factors focus primarily on the function and purpose of the board rather than the practical considerations required in the manufacturing process.

The main production difficulties of high-level circuit boards, such as interlayer alignment, inner layer circuit production, lamination production, drilling production and other technical difficulties. In view of the main manufacturing difficulties, the production control points of key processes such as interlayer alignment control, lamination stack structure design, inner layer circuit process, lamination process.

When purchasing PCBA circuit boards, various possible factors should be included in the evaluation, and the supplier's technology, management, and service level should be comprehensively considered to ensure that the quality of the purchased product PCBA circuit boards is guaranteed, the benefits are maximized, and a good foundation is laid for the subsequent production of electronic products.

After the production of the circuit board is completed, a series of inspection work needs to be carried out on the circuit board. In the case of ensuring the quality of the circuit board, the packaging and delivery will be delivered to the customer. Then for the circuit board production company, the most common seven kinds of inspections are What is the method!

PCB Assembly can provide insightful tips for effective circuit board design, keeping you informed of current and improved technologies and materials. You can also learn about current PCB assembly trends to implement in your project.

PCB has become a means of optimizing the production process of electronic devices. Those electronic devices that used to be hand-made have to be replaced by PCB, because more functions will be integrated on the circuit board.

PCB circuit board inks are generally divided into three types, namely PCB circuit etching ink, solder mask ink and text ink. There are also conductive carbon oil (also called conductive carbon ink) and conductive silver oil (also called conductive silver paste), the latter two are generally used in relatively small amounts.

As the PCB size requirements become smaller and higher, the device density requirements become higher and higher, and the PCB design becomes more and more difficult. How to achieve high PCB routing rate and shorten design time? Then let's talk about the design skills of PCB planning, layout and routing.

In the design of PCB circuit boards and the production process of circuit boards, engineers must not only prevent PCB circuit boards from being accidentally encountered during the manufacturing process, but also avoid design errors.

There are many ways to solve the EMI problem. Modern EMI suppression methods include: the use of EMI suppression coatings, the selection of appropriate EMI suppression spare parts and EMI simulation design. This article starts from the basic circuit board layout, PCSPCB and everyone discuss the role and design skills of PCB multilayer circuit board layered stacking in controlling EMI radiation.