When designing a multi-layer PCB circuit board, it is first necessary to determine the circuit board structure used according to the size of the circuit, the size of the circuit board and the EMC requirements, that is, to choose a four-layer, six-layer or multi-layer circuit board. After determining the number of layers, determine the placement of the internal electrical layers and how to distribute various signals to each layer.

The subtractive process is a method of selectively removing part of the copper foil on the surface of the copper-clad laminate to obtain a conductive pattern.The full addition method refers to that after a circuit is printed on an insulating substrate containing a photosensitive catalyst without copper cladding, the copper circuit pattern is plated on the substrate by chemical copper plating.

In the process of PCB design and production, engineers not only need to prevent accidents during PCB manufacturing, but also avoid design errors. This article summarizes and analyzes these common PCB problems, hoping to bring some help to your design and production work.

The warpage of PCB long board/strip board has a great influence on the production of printed circuit board, and warpage is also one of the important problems in the production process of PCB long board/strip board. The long board is bent after welding, and the component feet are difficult to align.

There is a lot of competition in the PCB manufacturing industry. Everyone is looking for the smallest improvements to give them an edge. If you seem to be falling behind schedule, it's possible that your manufacturing process is to blame. Use these simple tips to streamline your manufacturing process and keep your customers coming back.

Seven issues to consider when designing PCB printed circuit boards! For ease of expression, it is analyzed from seven aspects: cutting, drilling, wiring, solder mask, characters, surface treatment and forming.

Electroless copper plating is an autocatalytic redox reaction. Electroless copper plating has been widely used in our PCB manufacturing industry. At present, electroless copper plating is used for PCB hole metallization.

It is critical that PCBs have reliable performance, both in the manufacturing assembly process and in actual use. Fourteen important features of high-reliability PCB circuit boards.

The corresponding printed circuit boards also face the challenges of high precision, thinning and high density. The trend of printed boards in the global market is to introduce blind and buried vias in high-density interconnect products, so as to save space more effectively and make the line width and line spacing thinner and narrower.

The industry is very competitive these days, and everyone is looking for ways to integrate the most functionality with the smallest size and cost. Analog, digital, and RF circuits are all tightly packed together with very little space to separate their respective problem areas, and the number of board layers is often minimized due to cost considerations.

PCB multilayer board lamination process overview: pressure cooker, cap lamination, wrinkle, copper foil lamination, depression, kiss pressure, low pressure, kraft paper, lamination, large lamination.

PCB board sampling quality control method. Soldering is an important process step in the PCB proofing process. In order to ensure the soldering quality of the circuit board, you should be proficient in quality control methods and soldering skills.

What are the common problems encountered in the process of PCB circuit board proofing design? do you know? Let us introduce to you below!

Generally, a conductive pattern made of a printed circuit, a printed component or a combination of the two is called a printed circuit board on the insulating material according to the predetermined preset. The conductive pattern that supplies electrical connection between components on an insulating substrate is called a printed circuit. In this way, the printed circuit or the finished board of the printed circuit is called a printed circuit board, also known as a printed board or a printed circuit.

Commonly used PCB surface treatments are as follows: gold plating (gold plating, immersion gold), silver plating, OSP, tin spraying (lead and lead-free).

The conductive hole plugging process in PCB design, the conductive hole Via hole is also known as the via hole. In order to meet the customer's requirements, the via hole must be plugged. After a lot of practice, the traditional aluminum sheet plugging process is changed, and the board is completed with a white mesh. Surface solder mask and plug holes. Stable production and reliable quality.