Via is one of the important components of multi-layer PCB, and the cost of drilling usually accounts for 30% to 40% of the cost of PCB fabrication. Simply put, every hole on a PCB can be called a via.

We provide you with effective techniques to improve the PCB design layout rate and design efficiency, which not only saves the project development cycle for customers, but also maximizes the quality of the design finished products.

The solder mask process in PCB is to cover the printed board with solder mask after screen printing with a photographic plate to cover the pads on the printed board, so that it will not be exposed to ultraviolet rays during exposure, and the solder mask protective layer After UV irradiation, it is more firmly attached to the surface of the printed board, and the pads are not exposed to UV light, which can expose the copper pads for lead and tin during the hot air leveling process.

In order to properly understand the PCB manufacturing steps. Hopefully it provides circuit designers and newcomers to the PCB industry with a clear view on how to make printed circuit boards and avoid making those unnecessary mistakes.

PCB can be divided into single-sided, double-sided and multi-layered boards from the structure, and the design focus of different boards is also different.

The quality of PCB design has a great impact on the ability to resist interference. Therefore, when doing PCB design. The general principles of PCB design must be followed and the requirements of anti-interference design should be met.

PCB is the foundation and highway of electronic components. In this regard, the quality of the PCB is critical. To check the quality of the PCB, several reliability tests must be performed.

The primary task of PCB anti-interference technology design printed board is to analyze the circuit and determine the key circuit.

PCB is the core of electronic products, but the quality and price of raw materials are different. The use of low-priced raw materials to compete maliciously and disrupt the market is the fuse that causes dissatisfaction among other peers.

The thermal, mechanical and electrical behavior of each PCB depends on the material properties of the PCB substrate, conductors and component materials. Among these different materials, designers have the most control over the behavior of the board by choosing the correct PCB substrate material.

Electroless copper is widely used in the production and processing of printed circuit boards with through holes. Its main purpose is to deposit a layer of copper on a non-conductive substrate through a series of chemical treatments, which is then thickened to a specified thickness by a subsequent electroplating method.

As automated test equipment becomes part of the overall electronics assembly process, DFT must include not only traditional hardware usage issues, but also knowledge of the diagnostic capabilities of the test equipment. Full contact and large test pads are always goals in the manufacture of printed circuit boards.

Knowledge of PCB selective soldering technology and process, including the process characteristics of PCB selective soldering technology, the process of selective soldering technology, two different process drag soldering process and dip soldering process and the shortcomings of single-nozzle solder wave drag soldering process.

After the circuit is electroplated, the PCB circuit board removed from the electroplating equipment is processed to complete the circuit board. Equipment adjustment and interaction with corrosive solutions. The upper and lower PCB circuit boards have different etching states between the lead-in edge and the rear-entry edge.

High-precision PCB circuit board refers to the use of fine line width/spacing, tiny holes, narrow ring width (or no ring width), and buried and blind holes to achieve high density.

The English name of burr is veining. Generally, there are scraps and tiny microscopic metal particles on the surface of metal parts, which are called burrs. The more glitches, the lower its quality standard. Therefore, when enterprises produce products, they will try to reduce the burrs as much as possible.