PCB interconnection design technology includes testing, simulation and various related standards, among which testing is a method and means to verify various simulation analysis results.

We will explain the mechanisms that protect IC from ESD damage. Protecting IC and boards from ESD and EOS damage is a critical aspect of product reliability and performance.

Some of the software used for PCB copy boards are industry-specific software. There are many softwares for designing PCB board circuits. The required equipment: scanners, computers, and PORTEL99 and AUTOCAD software are required.

The design and manufacture of PCB copy board is moving from the subtractive method to the additive method. This article mainly explains the concepts and manufacturing processes of the PCB subtractive method and the additive method, for your reference and study!

The quality of PCB routing will directly affect the performance of the entire system. Most high-speed design theories will eventually be realized and verified through Layout. Routing is crucial in high-speed PCB design.

In order to solve the noise problem of PCB, it usually takes hours to carry out laboratory testing to find out the real culprit. However, many times we find that the noise problem is caused by the improper layout of the switching power supply.

Copper pouring is to use the idle space on the PCB as a reference plane, and then fill it with solid copper. These copper areas are also called pouring copper. The significance of copper coating is to reduce the impedance of the ground wire and improve the anti-interference ability; to reduce the voltage drop and improve the efficiency of the power supply; to connect to the ground wire can also reduce the loop area.

Problem analysis of PCB analog-digital mixed signal design. In mixed circuit design, although radio frequency and digital circuits are built on the same PCB, they are generally divided into radio frequency circuit area and digital circuit area, which are laid out and wired separately.

On the premise of existing electronic products and circuit boards, the reverse analysis of the circuit board is carried out by means of reverse research and development technology, and the technical documents such as the PCB file, the bill of materials (BOM) file, and the schematic file of the original product, as well as the PCB Silkscreen production files are restored 1:1.

PCB is an important link in the composition of electronic products. It is hard to imagine that there is no PCB in an electronic device, so the quality of PCB will have a great impact on whether the electronic product can work normally and reliably for a long time.

The first thing that needs to be considered in the design of high-speed DSP system PCB board is the problem of power supply design. In power supply design, the following methods are usually used to solve signal integrity problems.

The most widely used in PCB printed circuit boards is the micro-hole processing technology of epoxy resin-based composite materials (small holes with a diameter of 0.6 mm or less, and micro-holes with a diameter of 0.3 mm or less).

PCB electromagnetic interference is the process by which destructive electromagnetic energy is transmitted from one electronic device to another electronic device through radiation or conduction. There are two ways to transmit electromagnetic interference: one is conduction; the other is radiation. In actual engineering, interference between two devices usually involves coupling in many ways.

Scan the circuit board of the PCB copy board, record the detailed component location, and then remove the component to make a bill of materials (BOM) and arrange material procurement. The empty board is scanned into a picture and restored to a pcb board diagram by the copy board software document.

The special requirements for power transmission lines in mixed-signal PCB design and the requirement to isolate noise coupling between analog and digital circuits increase the complexity of layout and routing at design time.

The development of PCB horizontal plating technology is not accidental, but the need for special functions of high-density, high-precision, multi-functional, high-aspect-ratio multilayer PCB products is an inevitable result.