1. Autoclave pressure cooker
It is a container filled with high-temperature saturated water vapor and can be applied with high pressure. The laminated substrate (Laminates) sample can be placed in it for a period of time to force the water vapor into the plate, and then the plate sample can be taken out. It was placed on a high-temperature molten tin surface to measure its "anti-delamination" characteristics. This word is also synonymous with PressureCooker, which is more commonly used in the industry. In addition, in the multi-layer circuit board lamination process, there is a "cabin pressure method" with high temperature and high pressure carbon dioxide, which also belongs to this type of AutoclavePress.
2. CapLamination cap pressing method
It refers to the traditional lamination method of early multi-layer PCB boards. At that time, the "outer layer" of MLB mostly used thin substrates with copper skin of single-sided multi-layer circuit boards for lamination and lamination, until the output of MLB increased significantly at the end of 1984. , before switching to the current copper-skin-type large-scale or large-scale pressing method (MssLam). This early MLB lamination method using a single-sided copper thin substrate is called CapLamination.
3. Crease wrinkles
In the lamination of multi-layer circuit boards, it often refers to the wrinkles that occur when the copper skin is not handled properly. When the thin copper sheet below 0.5oz is laminated in multiple layers, this disadvantage is more likely to occur.
4. CaulPlate separator
When the multi-layer circuit board is pressed, many "books" of loose materials (such as 8~10 sets) of the board to be pressed are often stacked between each opening of the press machine (such as 8-10 sets), and each set of "loose materials" (Book) must be separated by a flat, smooth and hard stainless steel plate. The mirror stainless steel plate used for this separation is called CaulPlate or SeparatePlate. Currently, AISI430 or AISI630 are commonly used.
5. FoilLamination copper foil pressing method
Refers to the mass-produced multi-layer circuit board. The outer layer is made of copper foil and film directly laminated with the inner layer to become the multi-row board large-scale lamination method (MassLam) of the multi-layer circuit board, to replace the early single-sided thin substrate. Traditional pressing.
6. Dent depression
Refers to the gentle and uniform subsidence on the copper surface, which may be caused by the local point-like protrusion of the steel plate used for pressing. If these shortcomings unfortunately remain on the line after the copper is etched, the impedance of the high-speed transmission signal will be unstable, and noise will appear. Therefore, such defects should be avoided as much as possible on the copper surface of the substrate.
Shenzhen pinban Technology Co., Ltd. is a high-precision PCB multi-layer circuit board manufacturer, focusing on PCB circuit boards, HDI circuit boards, rigid-flex boards, high-frequency boards/high-frequency circuit boards, PCB blind and buried hole boards, Long strip, super long circuit board, long strip circuit board, double-sided super long board, super long circuit board, special circuit board, etc. The factory has imported and domestic boards all year round: the dielectric constant ranges from 2.2 to 10.6.
Seven, KissPressure kiss pressure, low pressure
When the multi-layer circuit board is pressed, when the plates in each opening are placed in position, the heating starts and is lifted from the bottom layer of the hot plate, and the strong hydraulic top column (Ram) is lifted upward to compress each opening. (Opening) in the bulk material for bonding. At this time, the combined film (Prepreg) begins to gradually soften and even flow, so the pressure used for the top extrusion should not be too high to prevent the sheet from sliding or the amount of glue flowing out too much. This initially lower pressure (15-50 PSI) is called "kiss pressure". However, when the resin in each film is softened and gelled by heat and is about to harden, it needs to be increased to the full pressure (300-500 PSI), so that the various loose materials can be tightly combined to form a solid multi-layer circuit board.
Eight, KraftPaper
Kraft paper is often used as heat transfer buffer when the multilayer circuit board or substrate board is laminated (laminated). It is placed between the platen and the steel plate of the pressing machine to ease the heating curve closest to the bulk material. Between multiple substrates or multi-layer circuit boards to be pressed. Try to make the temperature difference between the layers of the board as close as possible, and the commonly used specifications are 90 pounds to 150 pounds. Because the fiber in the paper has been crushed after high temperature and high pressure, it no longer has toughness and is difficult to function, so it must be replaced. This kind of kraft paper is boiled with a mixture of pine and various strong alkalis. After the volatiles escape and the acids are removed, it is washed and precipitated immediately; after it becomes pulp, it can be pressed again to become rough and cheap paper. material.
Nine, LayUp overlay
Before lamination of multi-layer circuit boards or substrates, it is necessary to align various loose materials such as inner layers, films and copper sheets with steel plates, kraft paper pads, etc. It can then be carefully fed into the press for hot pressing. This preparatory work is called LayUp. In order to improve the quality of multi-layer circuit boards, not only this kind of "lamination" work should be carried out in a clean room with temperature and humidity control, but also for the speed and quality of mass production, generally the large-scale platen method (MassLam ) construction, and even need to use the "automatic" stacking method to reduce human errors. In order to save factory buildings and shared equipment, most factories combine "stacking" and "folding" into a comprehensive processing unit, so the automation engineering is quite complicated.
10. MassLamination large platen (lamination)
This is a new construction method that abandons the "alignment pin" in the multi-layer circuit board lamination process and adopts multiple rows of boards on the same surface. Since 1986, when the demand for four- and six-layer circuit boards has increased, the lamination method of multi-layer circuit boards has changed a lot. In the early days, only one shipping board was arranged on a process board to be pressed. This one-to-one arrangement has been broken through in the new method, and it can be changed to one-to-two, or one-to-four, or even more according to its size. The plate is pressed together. The second of the new method is to cancel the registration pins of various loose materials (such as inner sheet, film, outer single-sided sheet, etc.); instead, the outer layer is changed to copper foil, and the "target" is prefabricated on the inner layer first. , to "sweep" out the target after pressing, and then drill a tool hole from its center, which can be set on the drilling machine for drilling. As for the six-layer circuit board or the eight-layer circuit board, each inner layer and the sandwich film can be riveted with rivets first, and then subjected to high temperature lamination. This simplified, fast and enlarged area of lamination can also increase the number of "stacks" (High) and the number of openings (Opening) according to the substrate-type approach, which can not only reduce labor, double the output, and even automate. The platen method of this new concept is called "large platen" or "large platen". In recent years, many professional OEM and pressing industries have appeared in China.
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