PCB hot air leveling technology is a relatively mature technology at present, but because its process is in a dynamic environment of high temperature and high pressure, the quality is difficult to control and stabilize.

The five common surface treatment processes for PCB are hot air leveling, organic coating, electroless nickel/immersion gold, immersion silver and immersion tin.

What aspects of printed circuit board design need attention: manufacturing requirements, drilling design, circuit design, solder mask design, character design, and shape design.

When quality issues arise during PCB manufacturing, it is often because the substrate material is the cause of the problem. Material issues due to variations in laminate quality occur between manufacturers using different batches of raw material or products made with different pressing loads.

According to the premise of the actual electronic product and the actual circuit board, the circuit board is reversely analyzed by means of reverse research and development technology, and the technical documents such as the PCB file, the bill of materials (BOM) file, and the schematic file of the original product, as well as the PCB silk screen production Files are restored 1:1.

PCB component layout is the key to achieving a good RF design, the most effective technique is to first fix the components located on the RF path, and orient them to minimize the length of the RF path, so that the input is far away from the output, and as far as possible Ground separates high-power circuits from low-power circuits.

The renaissance of PCB functional test technology is an inevitable result of the miniaturization of surface mount devices and circuit boards. With the rise of online testing and the relatively slow development of functional testing technology will regain the momentum of development.

PCB circuit board design refers to the production of circuit boards at the lowest possible cost through the design of schematic drawings and circuit layout.

PCB stencil mainly has the following factors that will affect the quality of PCB stencil. The production process of steel mesh includes: chemical etching method, laser cutting method, electroforming method.

The quality of PCB layout and routing will directly affect the performance of the circuit. Engineers need to understand the most basic principles and skills about PCB layout and routing, so that they can make their designs perfect.

With a high-density FPGA in a PCB design, there are likely to be many challenges that lie ahead of a well-designed schematic. Including hundreds of input and output ports, operating frequency exceeding 500MHz, and solder ball spacing as small as half a millimeter, all of these will lead to undue interaction between design units.

PCB interconnection design technology includes testing, simulation and various related standards, among which testing is a method and means to verify various simulation analysis results.

We will explain the mechanisms that protect IC from ESD damage. Protecting IC and boards from ESD and EOS damage is a critical aspect of product reliability and performance.

Some of the software used for PCB copy boards are industry-specific software. There are many softwares for designing PCB board circuits. The required equipment: scanners, computers, and PORTEL99 and AUTOCAD software are required.

The design and manufacture of PCB copy board is moving from the subtractive method to the additive method. This article mainly explains the concepts and manufacturing processes of the PCB subtractive method and the additive method, for your reference and study!

The quality of PCB routing will directly affect the performance of the entire system. Most high-speed design theories will eventually be realized and verified through Layout. Routing is crucial in high-speed PCB design.