In PCB design, to the final PCB mass production, PCB assembly is also a very important thing, which not only involves the quality standards of PCB circuit boards, but also affects the cost of PCB production.

There are three main ways of PCB assembly: V-CUT, punching slot and stamp hole. The size of the board can not be too large, nor too small, generally very small board can be assembled processing or convenient welding and assembly.

The outer layer of the PCB board has three main colors: gold, silver, and light red. Gold is the most expensive, silver is the cheapest, and light red is the cheapest. The circuit board inside the line is mainly pure copper, if exposed to the air is easy to be oxidized, the outer layer must have the above protective layer.

PCB common three kinds of drilling: through hole, blind hole, buried hole detailed explanation, let's first introduce the common drilling in PCB: through hole, blind hole, buried hole. The meaning and characteristics of these three kinds of holes.

PCB manufacturers use a variety of test methods to ensure PCB quality when shipping, which allow PCB manufacturers to test the effectiveness of components and PCBS. Here are some of the proven methods employed by PCB manufacturers.

For electronic equipment, the work will produce a certain amount of heat, so that the internal temperature of the equipment rises rapidly, if the heat is not dissipated in time, the equipment will continue to heat up, the device will fail due to overheating, and the reliable performance of the electronic equipment will decline.

In high-speed PCB design, the hole design is an important factor, it is composed of holes, the pad area around the hole and the POWER layer isolation area, usually divided into blind holes, buried holes and through holes three categories. In the process of PCB design, the parasitic capacitance and parasitic inductance of the through hole are analyzed, and some points for attention in the design of high-speed PCB through hole are summarized.

PCB Multi-layer circuit boards can be connected to the ground plane from the ground wire of each circuit in many ways, including: single point and multi-point grounding mode, mixed grounding mode, and connection method between ground.

Our PCB designers need to know the top 5 PCB design guidelines, by following these recommendations, you will soon be able to design powerful and capable, and have a truly high-quality printed circuit board.

I don't know if you have found this phenomenon: most PCB design layers are even layers, such as the common four-layer board, six-layer board. Why is that? In fact, even layer PCB do have more advantages than odd-layer PCB.

In the building of the circuit board, the conservative form of the circuit board is formed by wet film or dry film copper window stop route seal cutting, which accepts the reaction of wet film or dry film thickness, and the contact time between seal cutting liquid and copper surface is the center of consumption management.

PCSPCB focuses on the production of high-precision through hole FR-4 single-sided PCB board, double-sided circuit board, multi-layer circuit board, high-frequency board, blind hole board, high TG thick copper plate, special board. 20 problems of PCB design and wiring.

The quality of PCB design has a great impact on the interference and anti-interference ability of the circuit, and its performance is directly related to the quality of electronic equipment. This paper introduces the anti-interference measures that can be taken in the design and configuration of printing plates, and discusses in detail the methods of improving the reliability of the equipment and realizing electromagnetic compatibility.

The purpose of the test point is to test whether the components on the circuit board meet the specifications and weldability, for example, if you want to check whether the resistance on a circuit board has a problem, the easiest way is to take a multimeter to measure its two ends.

The cause of the board warping, one aspect is that the substrate used (coppered plate) may warp, but in the printed circuit board processing process, because of thermal stress, chemical factors, and improper production process will also cause the printed circuit board warping.

COB Bonding process refers to the process of attaching the bare chip directly to the printed circuit board, and then conducting lead bonding, and then wrapping the chip and lead with organic adhesive.