PCB Circuit Board Molding Method and Process

With the increasing demand for the reduction of the size of electronic facilities and the increase of profits, in order to respond to this request, the wiring of the circuit board is becoming more and more high-density, that is, the line distance and line width are gradually reduced, and the strength of the fine route that tends to become thinner and thinner is becoming weaker and weaker. In the building of the circuit board, the conservative form of the circuit board is formed by wet film or dry film copper window stop route seal cutting, which accepts the reaction of wet film or dry film thickness, and the contact time between seal cutting liquid and copper surface is the center of consumption management.

The conservative route forming form is as shown in the figure:

Method a first competes the substrate with the copper junction as the substrate, then stops the punching process as shown in method b to flush out the required holes, then stops the exposure of dry film or wet film as shown in method c, rinses as shown in method d, then stops seal cutting as shown in method e, and then strips the dry film or wet film as shown in method f to form the line. After the route is formed stop method g corresponds to the position of the ink printing, initially stop the nominal solution as shown in method h.

The route forming method has several advantages:

1. conservative circuit board forming form through wet film or dry film to form copper surface window stop route seal cutting, the method of water circuit board forming between the quality of the wet film or dry film thin and thick reaction, simultaneously also let seal cutting liquid and copper surface contact time change the center of consumption management, management difficulty;

2. the response of wet film or dry film thickness, the route curve is poor, simple emergence of rough edges;

3. the nominal solution is stopped after the formation of the route, so that the base material at the bottom of the route and the nominal solution of the solution are in direct contact for a long time, increasing the joint force of the copper surface route and the substrate, and the electrical trust is increased.

Skill completion factors:

In order to deal with the above skills, the invention needs a route forming method of the route plate.

The invention is completed by a secondary skill plan: a method for forming a route of a route board comprises the following method;

Method a: Compete the base material with the copper foil junction as the base material;

Method b: Flush out the required hole;

Method c: Installing the film in the name of copper foil;

Method d: Stop flushing for membrane;

Method e: For the copper foil name stop graphic false name solution, the copper foil name is forming a nominal solution layer;

Method f: Peel the film;

Method g: Stop differential seal cutting for copper foil name;

Method h: Ink printing in response to status.

It is further:

In method c, the film is a dry film or a wet film that can produce a light aggregation response; After pressing the dry film or coating the wet film in the name of copper foil, and then exposing the dry film or the wet film to light collection reaction, and then stop the flushing described in method d.

In method d, the copper foil is washed and the whole dry film or wet film is melted by reaction, and the copper surface of the route is formed by bare exposure demand.

In method e, the surface of copper that is being exposed stops the non-copper spirit of the graphic pseudonym solution, and the thickness of the nominal solution layer is 0.01um ~ 3um.

In method g, the differential seal cutting is the seal cutting copper, there is no seal cutting nominal resolution layer.

The graphics are pseudonyms of silver-plated tin lead, silver-plated pure tin, tin, spray tin, silver-plated gold, gold, silver, silver-plated nickel, silver-plated nickel gold or nickel-palladium gold.

The circuit board is pcb, fpc, tcp, cof, hdi or rf.

The circuit board is single panel, double panel or multi-layer board.

The unhelpful effects of this creation compared to the old skill are:

1. the use of non-copper spirit than the wet film or dry film is thinner than the name of the solution to stop the poor assimilation of seal cutting, so the seal cutting in the name of the cutting process is faster, increase the difference between the seal cutting liquid and the copper surface contact, complete a more detailed line seal cutting;

2. absolutely in the conservative process, the nominal solution process in the method is in advance of the seal cutting, preventing the base material at the bottom of the route and the nominal solution of the liquid direct contact for a long time, and improving the joint force of the copper surface route and the substrate.

Detailed form of operation

The above will be combined with the drawings in the Creation Exercise, and it is clear that the described exercise is only a whole exercise of the Creation and not a whole exercise. Based on the examples in this creation, all other examples that ordinary skilled personnel in this sphere are losing without the major premise of creating creative rest fall under the scope of this creation cover.

A route molding method of a route plate, the detailed processing of the route board can be pcb, fpc, tcp, cof, hdi or rf, can be a single panel, double panel or multi-layer board;

The method is as follows:

Method a:

The substrate 1 and copper foil 2 are combined to compete as the substrate; Substrate 1 can choose polyimide;

Method b:

Flush out the required hole 3; Hole 3 can be sprocket tooth hole, positioning hole, etc.;

Method c:

Film 4 is being installed in the name of copper foil 2; Film 4 is a dry film or a wet film that can produce a light aggregation response; After pressing the dry film or coating the wet film in the name of copper foil 2, and then exposing the dry film or wet film to light collection reaction, and then stop washing method d;

Method d:

For membrane 4 stop flushing; Wash the copper foil 2 nominal demand to stop the non-copper spirit of the name of the dry film or wet film reaction under the copper to dissolve, bare exposed demand constitutes the copper surface of the route;

Method e:

The exposed copper surface stops the non-copper spirit of the graphic pseudonym solution, and the thickness of the nominal solution layer 6 is 0.01um ~ 3um. Graphics pseudonyms are silver plated tin lead, silver plated pure tin, tin coated, tin sprayed, silver plated gold, gold plated, silver plated nickel, silver plated nickel gold or nickel palladium gold;

Method f:

Peel the film 4, peel the surplus dry film or wet film on the cabinet surface, so that the copper surface is fully exposed;

Method g:

For copper foil 2 name stop difference type seal cutting; Differential seal cutting is the selective seal cutting, the seal cutting only or secondary seal cutting copper, no seal cutting or no seal cutting non-copper spirit resolution layer;

Method h:

For echo status ink printing; Method h can either stop nominal resolution or not.

The unhelpful effects of this exercise are:

First, it is well known that the curve of the route of seal cutting is affected by the thin and thick reaction of dry film or wet film, the larger the thin and thick, the worse the curve and the more raw edges, and the other way around. When the same character seal cutting is stopped, it is not affected by the thin thickness of dry film or wet film, but by the thin thickness of the nominal resolution layer, and the thin thickness of the non-copper mental image false resolution layer in this practice is 0.01um ~ 3um, which is thinner than the thin thickness of dry film or wet film. Because when the route is forming, that is, when the seal is cut, the line cut into the curve is better, the raw edge is less, and the quality is higher.

Secondly, when seal cutting, the thickness of the dry film or wet film reflects the recovery progress of the seal cutting liquid in the name of the seal cutting, the thicker the thickness, the slower the recovery progress, and the greater the difference in the depth of the simultaneous seal cutting liquid, on the contrary, which is why the conservative route molding process takes the time of the seal cutting liquid and the copper surface contact as the center of consumption management. In this application, the thickness of the nominal solution layer is not affected by the thin thickness of dry film or wet film, but by the thin thickness of the nominal solution layer. The non-copper mental image of this application is thinner than the thin thickness of dry film or wet film, so the restoration progress of the nominal seal cutting liquid to be cut is faster, and the difference of the depth of the seal cutting liquid is increased. Can complete more detailed route seal cutting.

Initially, compared with the conservative process, the nominal solution process is advanced, that is, the nominal solution is carried out in the line molding line, preventing the long-term direct contact between the substrate at the bottom of the line and the nominal solution solution, and improving the joint force of the copper surface route and the substrate.