PCB circuit board laminate problem has puzzled everyone for a long time. After discussing with the engineer for a long time, I was able to write this article. We exemplify some common problems of PCB laminates and related solutions. If you encounter common problems such as PCB board laminates, you should formulate a standard standard, and you can solve such problems in the future.

High-frequency and high-speed PCB design technology has become an important research field. This article first gives a brief introduction to high-frequency circuit boards, and then expounds the wiring skills of high-frequency circuit boards in PCB design. Finally, it introduces the precautions for high-frequency circuit board wiring in PCB design.

PCB multilayer board is a special printed circuit board, and its "features" are generally special. For example, there will be PCB multilayer boards in six-layer circuit boards. This kind of multi-layer board can help the machine to conduct all kinds of different circuits, not only that, but also has the effect of insulation, which will not let electricity and electricity collide with each other, which is completely safe.

Since the era of iPhone (Apple), almost all mobile phones have used black pcb circuit boards. What prompted this change? What is so special about the black pcb circuit board?

The important role of PCB design in power circuit design need not be repeated. The PCB is the physical platform for circuit design and the most flexible part for the design and manufacture of original components. So how can we better use the design software to layout the PCB? What are its design rules? In this article, we will share those golden rules of PCB design that we call "timeless".

The output value of the global electroplating PCB industry accounts for a rapid increase in the proportion of the total output value of the electronic component industry. It is the industry with the largest proportion of the electronic component subdivision industry and occupies a unique position. The annual output value of electroplating PCB is 60 billion US dollars. The volume of electronic products is becoming more and more thin and short, and the direct stacking of vias on through-blind vias is a design method to obtain high-density interconnection. To do a good stacking hole, first of all, the flatness of the hole bottom should be done well. There are several ways to make a typical flat hole surface, and the electroplating hole filling process is a representative one.

PCB plays a key role in realizing the functions of electronic products, which leads to the increasing importance of PCB design, because the performance of PCB design directly determines the function and cost of electronic products. A good PCB design can keep electronic products away from many problems, thus ensuring that the products can be manufactured smoothly and can meet all the needs of practical applications.

At the same time, PCB multilayer boards are also developing towards the extremes of high, precise, dense, fine, large and small. An important process in the manufacture of PCB multilayer boards is lamination, and the control of lamination quality is becoming more and more important in the manufacture of multilayer boards. Therefore, to ensure the lamination quality of PCB multi-layer boards, it is necessary to have a good understanding of the lamination process of PCB multi-layer boards.

With the development of the electronics industry, the integration of electronic components is getting higher and higher, and the volume is getting smaller and smaller, and BGA type packages are generally used. Therefore, the lines of the multi-layer PCB will be smaller and smaller, and the number of layers of the circuit board will be more and more. Reducing the line width and line spacing is to use the limited area as much as possible, and increasing the number of layers is to use the space. In the future, the main circuit of the PCB multi-layer circuit board will be 2-3 mil, or less.

The technical realization process of PCB copying is simply to scan the circuit board to be copied, record the detailed component positions, then remove the components to make a bill of materials (BOM) and arrange material procurement, and the empty board is The scanned image is processed by the copy board software and restored to a pcb board drawing file, and then the PCB file is sent to the plate making factory to make the board. After the board is made, the purchased components are welded to the finished PCB board, and then tested by the circuit board and debugging.

PCB circuit board packaging is a crucial process, but many PCB board companies do not pay much attention to this final process, so a lot of packing work is simply taken, so that the PCB board is not well protected, then It will cause problems such as easy damage or friction on the surface of the PCB circuit board.

PCB board is basically composed of aperture hole layer, DRILL layer, circuit layer, solder mask layer and character layer. In CAM350, each loaded layer will be distinguished by different colors, so as to facilitate The engineering of the circuit board factory is actually operated by the person who holds the position.

As the PCB size requirements become smaller and higher, the device density requirements become higher and higher, and the PCB design becomes more and more difficult. How to achieve a high PCB routing rate and shorten the design time, let's talk about the design skills of PCB planning, layout and routing.

What are the common problems of PCB circuit board production line, solder mask and text. The printed board is also still for a certain period of time, so that the gas in the ink on the surface of the board gradually evaporates with the flow of the ink, and then take it out. Go to a certain temperature to bake.

The average number of layers of PCB multilayer boards has become an important technical indicator to measure the technical level and product structure of PCB enterprises. This paper briefly describes the main processing difficulties encountered in the production of multi-layer circuit board proofing, and introduces the control points of the key production process of high-level circuit boards.

If the line width is too small, the resistance of the wires just printed will be large, and the voltage drop on the line will be large, which will affect the performance of the circuit. If the line width is too wide, the wiring density will not be high, and the board area will increase. In addition to increasing the cost, it is not conducive to miniaturization.