The quality of PCB design has a great impact on the ability to resist interference. Therefore, when doing PCB design. The general principles of PCB design must be followed and the requirements of anti-interference design should be met.

PCB is the foundation and highway of electronic components. In this regard, the quality of the PCB is critical. To check the quality of the PCB, several reliability tests must be performed.

The primary task of PCB anti-interference technology design printed board is to analyze the circuit and determine the key circuit.

PCB is the core of electronic products, but the quality and price of raw materials are different. The use of low-priced raw materials to compete maliciously and disrupt the market is the fuse that causes dissatisfaction among other peers.

The thermal, mechanical and electrical behavior of each PCB depends on the material properties of the PCB substrate, conductors and component materials. Among these different materials, designers have the most control over the behavior of the board by choosing the correct PCB substrate material.

Electroless copper is widely used in the production and processing of printed circuit boards with through holes. Its main purpose is to deposit a layer of copper on a non-conductive substrate through a series of chemical treatments, which is then thickened to a specified thickness by a subsequent electroplating method.

As automated test equipment becomes part of the overall electronics assembly process, DFT must include not only traditional hardware usage issues, but also knowledge of the diagnostic capabilities of the test equipment. Full contact and large test pads are always goals in the manufacture of printed circuit boards.

Knowledge of PCB selective soldering technology and process, including the process characteristics of PCB selective soldering technology, the process of selective soldering technology, two different process drag soldering process and dip soldering process and the shortcomings of single-nozzle solder wave drag soldering process.

After the circuit is electroplated, the PCB circuit board removed from the electroplating equipment is processed to complete the circuit board. Equipment adjustment and interaction with corrosive solutions. The upper and lower PCB circuit boards have different etching states between the lead-in edge and the rear-entry edge.

High-precision PCB circuit board refers to the use of fine line width/spacing, tiny holes, narrow ring width (or no ring width), and buried and blind holes to achieve high density.

The English name of burr is veining. Generally, there are scraps and tiny microscopic metal particles on the surface of metal parts, which are called burrs. The more glitches, the lower its quality standard. Therefore, when enterprises produce products, they will try to reduce the burrs as much as possible.

When designing a multi-layer PCB circuit board, it is first necessary to determine the circuit board structure used according to the size of the circuit, the size of the circuit board and the EMC requirements, that is, to choose a four-layer, six-layer or multi-layer circuit board. After determining the number of layers, determine the placement of the internal electrical layers and how to distribute various signals to each layer.

The subtractive process is a method of selectively removing part of the copper foil on the surface of the copper-clad laminate to obtain a conductive pattern.The full addition method refers to that after a circuit is printed on an insulating substrate containing a photosensitive catalyst without copper cladding, the copper circuit pattern is plated on the substrate by chemical copper plating.

In the process of PCB design and production, engineers not only need to prevent accidents during PCB manufacturing, but also avoid design errors. This article summarizes and analyzes these common PCB problems, hoping to bring some help to your design and production work.

The warpage of PCB long board/strip board has a great influence on the production of printed circuit board, and warpage is also one of the important problems in the production process of PCB long board/strip board. The long board is bent after welding, and the component feet are difficult to align.

There is a lot of competition in the PCB manufacturing industry. Everyone is looking for the smallest improvements to give them an edge. If you seem to be falling behind schedule, it's possible that your manufacturing process is to blame. Use these simple tips to streamline your manufacturing process and keep your customers coming back.