Fifteen Common PCB Soldering Problems: Poor Solder Bridge Solder Joints, Over Soldering, Solder Balls, Cold Seams, Overheating Joints, Tombstoning, Insufficient Moisture, Solder Funnels, Raised Pads, No Solder Joints, Solder Spatter , pin holes and air holes, solder marks, solder balls, solder discoloration。

Consider design factors during the PCB design phase. While manufacturing factors are equally important, these factors focus primarily on the function and purpose of the board rather than the practical considerations required in the manufacturing process.

The main production difficulties of high-level circuit boards, such as interlayer alignment, inner layer circuit production, lamination production, drilling production and other technical difficulties. In view of the main manufacturing difficulties, the production control points of key processes such as interlayer alignment control, lamination stack structure design, inner layer circuit process, lamination process.

When purchasing PCBA circuit boards, various possible factors should be included in the evaluation, and the supplier's technology, management, and service level should be comprehensively considered to ensure that the quality of the purchased product PCBA circuit boards is guaranteed, the benefits are maximized, and a good foundation is laid for the subsequent production of electronic products.

After the production of the circuit board is completed, a series of inspection work needs to be carried out on the circuit board. In the case of ensuring the quality of the circuit board, the packaging and delivery will be delivered to the customer. Then for the circuit board production company, the most common seven kinds of inspections are What is the method!

PCB Assembly can provide insightful tips for effective circuit board design, keeping you informed of current and improved technologies and materials. You can also learn about current PCB assembly trends to implement in your project.

PCB has become a means of optimizing the production process of electronic devices. Those electronic devices that used to be hand-made have to be replaced by PCB, because more functions will be integrated on the circuit board.

PCB circuit board inks are generally divided into three types, namely PCB circuit etching ink, solder mask ink and text ink. There are also conductive carbon oil (also called conductive carbon ink) and conductive silver oil (also called conductive silver paste), the latter two are generally used in relatively small amounts.

As the PCB size requirements become smaller and higher, the device density requirements become higher and higher, and the PCB design becomes more and more difficult. How to achieve high PCB routing rate and shorten design time? Then let's talk about the design skills of PCB planning, layout and routing.

In the design of PCB circuit boards and the production process of circuit boards, engineers must not only prevent PCB circuit boards from being accidentally encountered during the manufacturing process, but also avoid design errors.

There are many ways to solve the EMI problem. Modern EMI suppression methods include: the use of EMI suppression coatings, the selection of appropriate EMI suppression spare parts and EMI simulation design. This article starts from the basic circuit board layout, PCSPCB and everyone discuss the role and design skills of PCB multilayer circuit board layered stacking in controlling EMI radiation.

On the basis of years of actual production experience and service experience, we are now making a brief and concise analysis of the causes of blistering on the surface of the circuit board immersed copper electroplating. The effect of throwing bricks and attracting jade!

Fifteen common soldering problems for printed circuit boards: poor solder bridge solder joints, over soldering, solder balls, cold seams, overheated joints, tombstones, insufficient moisture retention, solder funnels, raised pads, no solder joints, solder spatter, Pin holes and air holes, solder marks, solder balls, solder discoloration.

The printed circuit board will be checked for 100% flatness during final inspection. All unqualified boards will be picked out, placed in an oven, baked at 150 degrees Celsius and under heavy pressure for 3 to 6 hours, and cooled naturally under heavy pressure. Then remove the pressure and take out the board, and check the flatness, which can save part of the board.

We will encounter various safety spacing problems in ordinary life, such as the spacing between vias and pads, and the spacing between traces and traces, which are all things we should consider.

OSP is to chemically grow an organic film on the clean bare copper surface. This layer of film has anti-oxidation, thermal shock resistance, moisture resistance, and is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in the normal environment; but in the subsequent high temperature welding, this protective film must be very It is easily and quickly removed by the flux, so that the exposed clean copper surface can be combined with the molten solder to form a strong solder joint in a very short time.