1. The basic steps of CAM manufacturing
Each PCB board is basically composed of aperture hole layer, DRILL layer, circuit layer, solder mask layer and character layer. In CAM350, each loaded layer will be distinguished by different colors, so as to facilitate The engineering of the circuit board factory is actually operated by the person who holds the position.
2. Import files
First semi-automatically import the file of the circuit board (File-->Import-->Autoimport), check whether the information of the circuit board has everything, align the layers (Edit-->Layers-->Align) and set the origin position (Edit-- >Change-->Origin-->Datum Coordinate), perform layer arrangement in a certain order (Edit-->Layers-->Reorder), delete useless layers (Edit-->Layers--> Reorder).
3. Disposal drilling
When the customer does not provide the drilling file for the PCB, the hole position can be converted into Flash (Utilities-->Draw-->Custom, Utilities-->Draw-->Flash-->Interactive) and then converted into drilling (In the case of drilling editing, Utilities-->Gerber to Drill); if there is a drilling file provided, directly increase it according to the manufacturing requirements.
Continue to check whether the minimum hole diameter specification, the minimum distance between the hole edge and the hole edge (or slot) (Analysis-->Check Drill), and the minimum distance between the hole edge and the forming edge (Info-->Measure-->Object-Object) Satisfied with the process and experience.
4. Line disposal
First survey the minimum wire diameter and wire spacing (Analysis-->DRC) to see if they are satisfied with the process and have experience. Continue to perform wire diameter compensation (Edit-->Change-->Dcode) according to the type of PC board and the thickness of the copper foil of the substrate, and check whether the line PAD is offset relative to the drill hole (if the PAD is biased, use Edit-->Layers -->Snap Pad to Drill instruction; if the drilling is deviated, use Edit-->Layers-->Snap Drill to Pad instruction), whether the Ring of the line PAD is large enough (Analysis-->DRC), the line and NPTH Whether the distance between hole edge, groove edge and forming edge meets the manufacturing requirements. Whether the line PAD of the NPTH hole is deleted (Edit-->Delete). After the above is completed, use DRC to check whether the spacing between lines and lines, lines and PAD, and PAD and PAD meet the manufacturing requirements.
5. Solder mask treatment
Check the working condition of solder mask and circuit PAD matching (Analysis-->DRC), solder mask and line spacing, solder mask and line PAD spacing (copy the line and solder mask to one layer, and then use Analysis-->DRC command to check this layer), the minimum width of the solder mask, and whether there is a solder mask with a specified volume at the NPTH (Add-->Flash).
6. Deed disposal
Check the line width (Info-->Report-->Dcode), height (Info-->Measure-->Point-point), hollow diameter, distance between the letter and the line PAD, the distance between the letter and the forming edge, Whether the distance between the wedge and the hole or slot, the distance between the wedge and the PTH that does not eat tin meets the manufacturing requirements. Then add UL mark and DATE CODE mark according to customer requirements. Note:
a. UL mark and DATE CODE are usually added to the deed layer, but cannot be added in the Japanese text box of the parts area (no special explanation is necessary), nor can they be added in the area that is drilled, punched or formed scope.
b. When the customer has special requirements or the PCB has no book layer, the UL mark and the DATE CODE mark can be engraved on the PCB in the form of copper foil engraving (under the condition of not causing a short circuit or affecting the safety regulations) or directly hollowing out The word is added to the solder mask.
7. Consecutive and office side disposal
Execute concatenation (Edit-->Copy) and add office edge according to the specified concatenated form. Continue to add AI holes (Add-->Drill Hit), positioning holes, optical points, customer part numbers (Add-->Text), and Yang Xuan part numbers. The V-CUT corner that needs to pass through the V-CUT (Edit-->Line Change-->Fillet, if the fillet needs to be filled, use the following instructions: Edit-->Line Change-->Chamfer). A little bit also requires adding ET chapter, V-CUT testing the place to do the test, drilling the broken hole, second drilling the foolproof test line and PAD, identifying the mark and so on.
8. Typesetting and manufacturing of craft edges
After the typesetting is performed according to the typesetting form on the cutting table, the manufacturing process shall be carried out according to the manufacturing specifications.
9. Press fit
Operation: Tables-->Composites. Press Add to add a Composites Name, Bkg is to set the polarity (positive, negative) of the screen background, Dark is the positive property (add layer), Clear is the negative property (reduce layer).
At the same time as the above investigation and disposal office, the customer's original data is checked and checked, and the "D/S&MLB Original Data CHECK LIST" is recorded and submitted to the supervisor for review and approval. If the final results of the above investigations are not suitable for the experience in the process, appropriate corrections should be made according to the specifications or the supervisor should be notified for disposal.
10. Output drilling and light drawing data
After the CAM data is manufactured, it is necessary to record the minimum wire diameter, wire spacing and the size of the copper foil plane or surface of the original film and office film (Analysis-->Copper Area).
After being checked by a special person, print the aperture hole position and drilling report statement, and output the drilling (File-->Export-->Drill Data) and light drawing data (File-->Export- -> Composites). Drilling output style: Leading 3,3 metric (Multilayer board issued to Mingwang is Trailing 3,3 metric).
Light drawing data output style: Gerber Rs-274-X, Leading 2,4 Imperial.
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