Today, we bring you a complete version of the circuit board production process, hoping to let you have a deeper understanding of the production of circuit boards!
cutting
Objective: According to the requirements of engineering data MI, the large sheet plate that meets the requirements is cut into small pieces for production. Small sheet material that meets customer requirements.
Process: large plate → cut plate according to MI requirements → curium plate → beer round Angle \ edge grinding → out plate
borehole
Objective: According to the engineering data, drill out the desired aperture at the corresponding position on the sheet material with the required size.
Process: Stack pin → top plate → drilling → bottom plate → Inspection/repair
Sunk copper
Objective: Copper deposition is to deposit a thin layer of copper on the insulation hole wall by chemical method.
Process: rough grinding → hanging plate → automatic copper sinking line → lower plate → Dipping % dilute H2SO4→ thickening copper
Graph transfer
Purpose: Graphic transfer is the transfer of the image on the production film to the board
Process: (blue oil process) : grinding plate → printing the first side → drying → printing the second side → drying → explosion → impact → check; (dry film process) : hemp board → film pressing → static → alignment → exposure → static → impact → inspection
Pattern plating
Objective: Pattern electroplating is to electroplate a copper layer and a gold nickel or tin layer of required thickness on the exposed copper skin or hole wall of the line pattern.
Process: upper board → oil removal → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → acid leaching → tinning → water washing → lower board
debunching
Objective: To expose the non-line copper layer by receding the anti-plating coating with NaOH solution.
Process: Water film: socket → alkali leaching → washing → scrubbing → passing machine; Dry film: Placing plate → passing machine
etching
Objective: Etching is to use chemical reaction method to corrode the copper layer of non-line parts.
Green oil
Purpose: The green oil is to transfer the pattern of the green oil film to the board to protect the line and prevent the tin on the line when welding parts
Process: grinding plate → printing green oil → curium plate → exposure → impact; Grinding board → printing the first side → drying board → printing the second side → drying board
character
Purpose: A character is a token provided for easy recognition
Process: green oil final curium → cooling static → adjustment screen → printing characters → curium
Gold-plated finger
Objective: To plate a layer of nickel \ gold with required thickness on the plug finger to make it more hard and wear resistant
Process: upper plate → oil removal → water washing twice → micro-etching → water washing twice → pickling → copper plating → water washing → nickel plating → water washing → gold plating
tinplate
Objective: Tin spraying is to spray a layer of lead tin on the exposed copper surface not covered with solder resistance oil to protect the copper surface from corrosion and oxidation, so as to ensure good welding performance.
Process: Micro-etching → air drying → preheating → rosin coating → Solder coating → hot air smoothing → air cooling → washing and air drying
molding
Objective: Through the mold stamping or CNC gong machine gong out the customer needs the shape forming method organic gong, beer plate, gong, hand cutting
The accuracy of the data gong machine plate and the beer plate is higher, the gong is followed by the hand cutting board can only do some simple shapes.
test
Objective: To detect the defects of open circuit and short circuit which are difficult to be detected by electronic 100% test.
Process: Die → plate → test → Qualified →FQC eye inspection → Unqualified → Repair → back test →OK→REJ→ scrap
Final inspection
Objective: Through 100% eye inspection of the appearance defects of the board, and repair of minor defects, to avoid the leakage of faulty and defective board.
Specific workflow: incoming materials → view data → eye inspection → Qualified →FQA spot check → Qualified → Packaging → Unqualified → Processing → check OK
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