Printed circuit boards are the substrates used to assemble electronic parts, with a global output of $45 billion a year, second only to the semiconductor industry in the electronics industry, and China's growth rate is much higher than the industry average. Today, electronic products are changing rapidly, price wars have changed the structure of the supply chain, and China has both cost and market advantages. Due to the impact of cost and downstream industry transfer, the industry is gradually shifting to China, which is the most growth market in the world.
Low-end (below 4 layers) entry barriers are relatively low, competition is more adequate, concentration is low, by the downstream machine price pressure, product prices often face downstream manufacturers to squeeze prices. The high-end (HDI, etc.) technology, equipment, process and other requirements are very high, the barriers to entry are high, the expansion cycle is long, and the supply is in short supply in China.
Chinese manufacturers rapid expansion of production capacity, increasing output value, products to high-end development, Chinese manufacturers still have a lot of room for growth.
CCL(copper clad plate) and downstream machine products across the board, the price transmission is not so direct, the concentration is relatively high, the bargaining power ratio is high, but the single use of the product leads to a strong dependence on; Due to the demand for low-end products and special plates, resulting in low costs and small manufacturers for specific market segments have room to live, and industry integration is more difficult.
CCL large manufacturers to implement the scale leading strategy, there is a larger expansion action, the strong constant strong pattern to maintain, the release of production capacity concentrated in 2007-2008, but the first half of 2008 is the traditional off-season, price war is difficult to avoid. Concentration is a trend in the long run, but the pain of short-term profit losses is inevitable.
Higher raw material prices have led to strong margins for upstream producers, and increased environmental protection by the Chinese government has accelerated consolidation in downstream industries, raising barriers to entry and forcing weakly competitive companies out of the industry. The electronic yarn industry is developing in the direction of muslin, and there is an in-house trend of kiln plants. The production scale of electronic cloth depends on the size of the kiln, the investment is large, and the concentration is higher. The ability of technological innovation, the demand of emerging industries and the ability to track and guarantee the demand of high-end large customers are the key for manufacturers to obtain high profits.
The raw materials used for processing the circuit board are mainly substrate, copper foil, PP, photosensitive materials, soldering paint, negatives, etc. Next, PCB manufacturers will briefly tell you the raw materials required for circuit board production.
1. substrate: generally for organic insulating materials, special uses useful ceramic materials as the substrate. Organic insulation materials can be divided into thermosetting resins or thermoplastic polymers for rigid or flexible PCBS, respectively. Now commonly used thermosetting resins are phenolic resin and epoxy resin, thermoplastic polyesters are polyimide and polytetrafluoroethylene and so on.
For all PCB substrates, thermosetting resin or thermoplastic polyester (A STAGE) is coated on the base reinforcing material - paper, cloth, glass cloth or glass felt, and then enters the drying room to dry, remove most of the volatile components in the resin or polyester, and achieve a semi-cured state, the so-called B STAGE (B STAGE), also known as pre-impregnated material. Then, according to the thickness of the required substrate, the number of layers of pre-impregnated material is selected, and the copper foil is placed on the upper and lower parts according to the single and double panels, and then entered into the laminate machine together - in the environment of high temperature and pressure, the material is further cured, and the B-stage material is cured into the C-stage (C STAGE), so the substrate is generally called copper-coated laminate. Class C materials usually have good stability, electrical insulation and chemical resistance.
The finished substrate is mainly 36"*48", 40"*48", 42"*48" several sizes.
2. copper foil: The metal foil covered on the PCB is mostly copper foil, made of calendered or electrolytic method, the thickness is generally from 0.3mil to 3mil (0.25oz/ft2 to 2oz/ft2), according to the bearing current size and etching accuracy. The influence of copper foil on the quality is mainly the surface dents, pitting, anti-stripping strength, etc.
3. PP: PP is an indispensable interlayer adhesive for the preparation of multi-layer plates, which is actually a B-level resin.
4. photosensitive material: photosensitive material is divided into photoresist and photosensitive film, that is, the industry known as wet film and dry film. The coating of the photoresist on the copper clad plate will undergo chemical changes when the light is at a certain wavelength, thus changing the solubility in the solvent (developer). It also has a positive (photodecomposition) and negative (photopolymerization) difference, the negative resist means that before exposure can be dissolved in the developer, after exposure into the polymer is not soluble in the developer; Positive resist, by contrast, produces a polymer that is soluble in the developer. Photosensitive film that dry film also has negative and positive, that is, photopolymerization type and photodecomposition type, they are very sensitive to ultraviolet light. There is a big gap in price between dry film and wet film, but because dry film can provide high precision line and etching, there is a tendency to replace wet film.
5. anti-solder paint: anti-solder paint is also called ink, in fact, is a kind of solder resistance, common is a liquid photosensitive material that does not have affinity for liquid solder, and will change and harden under specific spectral irradiation. Other use UV green oil and wet oil, screen printing directly after the board can be. The actual color of the PCB is the color of the welding paint.
6. film: also known as film, similar to the photographic polyester film, are the use of photographic materials to record image data materials, with high contrast, light and resolution, but require a low photographic speed. Using glass as the base plate can meet the requirements of fine lines and dimensional stability.
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