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What are The PCB Manufacturing Process and Precautions

2022-06-16 15:00:15 Water

First-class production comes from first-class design, the production of panel technology can not be separated from your design, the engineers please design according to the conventional production process details.

PCB circuit board related design parameters detailed explanation:

1. via hole (commonly known as conductive hole)

a. Minimum aperture :0.3mm(12mil)

b. The minimum through hole (VIA) aperture is not less than 0.3mm(12mil), the single side of the pad can not be less than 6mil(0.153mm), preferably greater than 8mil(0.2mm) is not limited to this point is very important, the design must be considered.

c. Through the hole (VIA) hole to hole spacing (hole edge to hole edge) can not be less than :6mil preferably greater than 8mil This point is very important, the design must be considered.

d. Spacing between pad and contour line 0.508mm(20mil)

2. Line

a. Minimum line distance: 6mil (0.153mm). The minimum line distance, that is, the line to the line, the distance from the line to the pad is not less than 6mil from the production point of view, the bigger the better, the general practice in 10mil, of course, the design conditions, the bigger the better this point is very important, the design must be considered.

b. Minimum line width: 6mil (0.153mm). That is to say, if the line width is less than 6mil, it will not be produced, (the minimum line width of the inner layer of the multi-layer board is 8MIL) If the design conditions permit, the larger the design, the better the design, the larger the line width, the better the production of our PCB factory, the higher the yield of the general design routine is very important at 10mil or so, the design must be considered.

c. Line to contour line spacing 0.508mm(20mil)

3. PAD pad pad (commonly known as plug-in hole (PTH))

a. plug-in hole (PTH) welding disc outer ring side can not be less than 0.2mm(8mil) of course, the larger the better this point is very important, the design must be considered.

b. Plug-in hole (PTH) hole to hole spacing (hole edge to hole edge) can not be less than: 0.3mm of course, the bigger the better this point is very important, the design must be considered.

c. The size of the plug-in hole depends on your components, but it must be larger than your component pin, it is recommended that it is greater than at least 0.2mm, that is, 0.6 of the component pin, you have to design at least 0.8 to prevent processing tolerances and difficult to insert.

d. Spacing between pad and contour line 0.508mm(20mil)

4. anti-welding: plug-in hole window, SMD window side can not be less than 0.1mm(4mil)

5. the character (the design of the character, directly affects the production, whether the character is clear to the character design is very relevant)

a. The character width can not be less than 0.153mm(6mil), the word height can not be less than 0.811mm(32mil), the ratio of width to height is the best relationship of 5, that is, the word width of 0.2mm word height is 1mm, so as to push the class.

6. nonmetallic slot: the minimum spacing of the slot is not less than 1.6mm, otherwise it will greatly increase the difficulty of milling

7. Make up

a. There is no gap patchwork, and there is a gap patchwork, there is a gap patchwork gap should not be less than 1.6(plate thickness of 1.6)mm, otherwise it will greatly increase the difficulty of milling edge patchwork board size is different depending on the equipment is different, no gap patchwork gap of about 0.5mm process edge can not be less than 5mm.

PCB circuit board manufacturing related precautions

1. Original documents on PADS design

a. The face attribute of the dual-panel file PADS should be selected Through, not Partial, which cannot generate drilling files, which will lead to leaking drilling.

b. Do not add slots in PADS together with components, because GERBER cannot be generated normally. In order to avoid leaking slots, please add slots in DrillDrawing.

c. PADS are laid in copper mode, and the manufacturer uses Hatch mode to lay copper. After the customer's original files are moved, the copper should be re-laid for preservation (with Flood laying copper) to avoid short circuit.

2. Documents about PROTEL99SE and DXP design

a. The manufacturer Solder only depends on the Solder mask layer. If the solder Paste layer needs to be made and the solder window with more than one solder layer cannot generate GERBER, please move to the solder mask layer.

b. Do not lock the contour line in the Protel99SE, and GERBER cannot be generated normally.

c. Do not select the KEEPOUT option in the DXP file. This will screen contour lines and other components, and GERBER cannot be generated.

d. The two documents please pay attention to the front and back design, in principle, the top is positive, the bottom to be designed into the opposite word, the manufacturer is from the top to the bottom superposition board. Single plate should pay special attention to, do not mirror at will! It might be the other way around.

3. Other precautions for PCB circuit board

a. Shape (such as plate frame, slot, V-CUT) must be placed on the KEEPOUT layer or mechanical layer, can not be placed on other layers, such as screen printing layer, line layer. All slots or holes that need to be mechanically formed should be placed in one layer as far as possible to avoid leaking slots or holes.

b. If the shape of the mechanical layer and KEEPOUT layer is inconsistent, please make special instructions, and the shape should be effective shape, if there is an inner groove, the line segment of the plate shape at the intersection of the inner groove should be deleted, so as to avoid leakage of the inner groove. The groove and hole designed in the mechanical layer and KEEPOUT layer are generally made according to no copper holes (copper should be cut when making film). If it needs to be processed into metal holes, please make special remarks.

c. With three software design, please pay special attention to whether the key position needs to expose copper.

d. If the safest way to do the metallization slot is to combine multiple pads, this practice must not be wrong.

e. Goldfinger board order please note whether bevel chamfering is required.

f. Please check the GERBER file to see if there are fewer layers in the file. Generally, the manufacturer will directly produce the GERBER file.

g. Under normal circumstances, gerber adopts the following naming methods: component surface line: gtl, component surface resist welding: gts, component surface character: gto, welding surface line: gbl, welding surface resist welding: gbs, Shape: gko, hole drawing :gdd, drilling: drll.