The difference between blind holes and through holes in PCB circuit board design, blind holes and through holes are two common types of holes, they play an important role in the manufacturing process of the circuit board.
1. Define
Blind Vias: A blind hole is a hole that connects the outer and inner layers but does not penetrate the entire PCB board. It connects one end to the outer layer and the other end to the inner layer, but does not penetrate the entire plate.
Through Hole Vias: Through hole is a hole that penetrates the entire PCB board and connects the conductive path between multiple layers. It connects one end to one layer and the other end to another layer, penetrating the entire board.
2. Features
Characteristics of the blind hole:
a. Connect the outer layer and the inner layer: the blind hole connects the outer layer and the inner layer of the PCB board, but does not penetrate the entire board.
b. Space saving: Since the blind hole does not penetrate the entire board, space can be saved in the design.
c. Increase density: Blind holes can improve the wiring density of the PCB board, so that more circuit components can be placed in a limited space.
d. Increased cost: Due to the relatively complex manufacturing process of blind holes, it will increase the cost of PCB boards.
Characteristics of the hole:
a. Penetrate the entire board: The hole connects multiple layers of the PCB board and penetrates the entire board.
b. Connect multiple layers: Through holes can connect the conductive path between multiple layers, making the circuit design more flexible.
c. Increase stability: The hole can improve the stability of the board because it connects multiple layers.
d. Cost reduction: The manufacturing process of the hole is relatively simple, so the cost of the PCB board can be reduced.
3. Application scenario
Application scenarios of blind holes:
a. High-density circuit board: In high-density circuit board design, blind holes can improve the wiring density, so that more circuit components can be placed in a limited space.
b. Multi-layer circuit board: In the multi-layer circuit board design, the blind hole can connect the circuit between different layers to improve the complexity of the circuit.
c. Radio frequency circuit board: In the design of radio frequency circuit board, blind holes can reduce the loss of signal transmission and improve the quality of signal transmission.
Application scenarios of through holes:
a. Multi-layer circuit board: In the multi-layer circuit board design, the hole can connect the circuit between different layers to improve the complexity of the circuit.
b. Power circuit board: In the design of the power circuit board, the hole can be connected to the power layer and the formation to improve the stability of the power supply.
c. Signal transmission circuit board: In the design of signal transmission circuit board, the hole can connect the signal layer and the formation to reduce the loss of signal transmission.
4. Pros and cons
Advantages and disadvantages of blind holes:
Advantages:
a. Space saving: The blind hole does not penetrate the entire board, so it can save space when designing.
b. Increase density: blind holes can improve the wiring density of the PCB board.
c. Suitable for high-density circuit board: blind hole is suitable for high-density circuit board design.
Cons:
a. Increased cost: The manufacturing process of blind holes is relatively complex, which will increase the cost of PCB boards.
b. Manufacturing difficulty: The manufacturing process of blind holes requires precise positioning and drilling technology.
Advantages and disadvantages of the hole:
Advantages:
a. Connect multiple layers: Through holes can connect conductive paths between multiple layers.
b. Increase stability: The hole can improve the stability of the circuit board.
c. Cost reduction: The manufacturing process of the hole is relatively simple, which can reduce the cost of the PCB board.
Cons:
a. Occupy space: The hole needs to penetrate the entire board, so it will occupy a certain space in the design.
b. May affect signal transmission: The hole may affect the quality of signal transmission, especially in high-frequency signal transmission.
5. Manufacturing process
Blind hole manufacturing process:
a. Drilling: First drill out the blind hole on the PCB board.
b. Copper plating: A layer of copper is plated on the inner wall of the blind hole to achieve electrical conductivity.
c. Fill conductive material: Fill the blind hole with conductive material, such as copper paste or silver paste.
d. Grinding: Grinding the blind hole to ensure that the surface is smooth with the PCB board.
Through the hole manufacturing process:
a. Drilling: First drill out of the hole on the PCB board.
b. Copper plating: A layer of copper is plated on the inner wall of the hole to achieve electrical conduction.
c. Welding: Welding conductive material, such as copper or silver wire, at both ends of the hole.
d. Grinding: grinding the hole to ensure that the surface is smooth with the PCB board.
6. Design considerations
When designing blind holes and through holes, the following points need to be noted:
a. Aperture size: According to the thickness of the circuit board and wiring density, select the appropriate aperture size.
b. Hole spacing: Keep sufficient hole spacing to avoid short circuit or signal interference.
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