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PCB Custom Processing Six Tin Removal Methods

2022-06-13 15:00:10 Water

PCB printed circuit board processing how to remove tin? Generally speaking, there are six methods: direct blowing of hot air gun, tin suction disassembly method, medical hollow needle disassembly method, electric soldering iron brush with disassembly method, increase solder melting disassembly method, and multiple copper wire tin suction disassembly method.

1. Blow directly with hot air gun

This is the most direct, simplest, and fastest method, with a heat gun around the integrated circuit block around the pin of the solder repeatedly blown, with a fine needle or blade slowly pry the integrated circuit block can be removed.

If you do not have a heat gun, you can use the following methods:

2. Tin suction and disassembly method

Disassemble the integrated block using a tin absorber, which is a common professional method, using a common suction and welding dual-purpose electric soldering iron with a power of more than 35W. When removing the integrated block, just place the heated dual-purpose electric soldering iron tip on the integrated block pin to be removed. After the solder joint is melted, it is sucked into the fine tin device. After the solder of all the pins is absorbed, the integrated block can be removed.

3. medical hollow needle disassembly method

Take a few hollow medical 8 to 12 needles. When in use, the inner warp of the needle is just over the pin of the integrated block. Disassemble the pin solder with the soldering iron, put the needle over the pin in time, then remove the soldering iron and rotate the needle, and pull out the needle after the solder solidifies. This makes the pin completely separate from the printed board. Once all the pins have been done this way, the block can be easily removed.

4. electric iron brush with disassembly method

The method is simple and easy, as long as you have a soldering iron and a small brush. When removing the integrated block, heat the electric iron first, and when it reaches the dissolving temperature, the solder on the pin is melted, and then brush away the melted solder. This allows the pin of the block to be separated from the printed board. The method can be carried out separately or separately. Finally, pry off the block with pointed tweezers or a small "one" screwdriver.

5. increase the solder melting disassembly method

This method is a hassle-saving method, as long as some solder is added to the pins of the integrated block to be removed, so that the solder joints of each column of pins are connected, so as to facilitate heat transfer and facilitate disassembly. When disassembling, use a soldering iron to heat each row of pins with pointed tweezers or a small "one" screwdriver to pry a pry, and the two rows of pins are heated alternately until they are removed. Under normal circumstances, each column of pins can be removed by heating twice.

6. multi-strand copper wire tin suction disassembly method

It is the use of multiple strands of copper core plastic wire, remove the plastic skin, and use multiple strands of copper core wire (short wire can be used). Before use, the multiple strands of copper core wire are coated with rosin alcohol solution, and after the electric soldering iron is heated, the multiple strands of copper core wire are heated on the integrated block pin, so that the solder on the pin will be adsorbed by the copper wire, and the part that absorbs the solder can be cut off. Repeat several times to absorb all the solder on the pin. Braided wire in shielded wire can also be used if possible. As long as the solder is sucked up and gently pry with tweezers or a small "one" screwdriver, the integrated block can be removed.