Today, I will tell you how to ensure the performance and stability of thick copper PCB design. Thick copper pcb design precautions. Thick copper PCB design is an indispensable part of modern electronic product design. Thick copper PCBS can provide better electrical conductivity and heat dissipation and are suitable for applications with high power and high frequency circuits. However, to ensure the performance and stability of the PCB, some key matters need to be noted during the design process. Next, we will introduce the precautions for thick copper PCB design.
Thick copper PCB design precautions
1. Choose the right thickness. Thick copper PCB usually refers to copper foil thickness greater than 1oz PCB board. Commonly used thicknesses are 2oz, 3oz, 4oz, etc., and its thermal and electrical conductivity is better than the standard 1oz copper foil. When choosing the thickness, it is necessary to decide according to the actual application requirements and load current to avoid over-design or insufficient situation.
2. Consider heat conduction. Since thick copper PCB has good thermal conductivity, the heat dissipation method should be reasonably designed to ensure that the temperature of the circuit board is within a controllable range. The heat dissipation effect can be improved by adding heat dissipation copper or designing heat dissipation holes. In addition, the high power device cooling sheet is closely contacted with the PCB board to improve the thermal conductivity effect.
3. Maintain good grounding and shielding. Good grounding design is an important factor to ensure signal integrity. For thick copper PCBS, the grounding circuit should be designed on a large enough copper surface area to reduce grounding resistance and reduce electromagnetic interference. When there is a high frequency signal in the PCB, it is also necessary to add appropriate shielding measures to prevent signal crosstalk and interference.
4. It's also important to deal with heat and expansion. Due to the strong thermal conductivity of thick copper PCBS, the device and solder joints may be subjected to uneven heat transfer, resulting in a large temperature gradient, which in turn causes PCB expansion and deformation. Therefore, the design needs to leave enough space, reasonable layout of the device and solder joints, considering the impact of temperature on the PCB.
5. Inspection and testing are indispensable steps. After the PCB design is completed, a comprehensive inspection and testing is carried out to ensure that there is no short circuit, open circuit, excessive heating and other problems. Use professional PCB design software for electrical inspection and size verification, and conduct actual circuit board sample testing to verify the feasibility and stability of the design.
In summary, the precautions for thick copper PCB design include selecting the appropriate thickness, reasonably handling thermal conductivity, good grounding and shielding, solving heat and expansion problems, and conducting a comprehensive inspection and testing. Only in these aspects are done in order to ensure the performance and stability of the PCB, to meet the requirements of modern electronic products for high power and high frequency circuits.
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