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PCB Circuit Board Impedance Process Control Points

2024-09-25 15:00:16 Water

The main purpose of PCB impedance control is to ensure the stable transmission of circuit board signals and improve the quality of signal transmission. Impedance is one of the main parameters of the circuit board when transmitting signals, and its value is related to the circuit board material, line structure, electrical signal frequency and so on.

Control points in the impedance process of PCB circuit board:

1. Material selection

Choosing the appropriate substrate material is important to achieve the desired impedance. Different substrate materials can affect signal speed and transmission line characteristics. Common high-frequency applications use materials with low dielectric constants, such as FR-4 plates or PTFE plates.

2. Physical size and layout

During the design process, physical dimensions such as line width, spacing and layer spacing will directly affect the impedance. Impedance changes on the circuit board can be reduced by reasonable layout and conductor direction.

3. Differential signal and microstrip line design

In the design of differential signal transmission line and microstrip line, it is very important to ensure that the impedance of the two lines matches. This can be achieved by controlling parameters such as distance between differential signals, microstrip line width and layer spacing.

4. Floor plan design

Good ground plan design is also important for impedance control. The use of a continuous ground plane layer can reduce the impedance change between the signal pin and the ground, and provide a good signal return path.

5. Impedance design and simulation verification

After the PCB impedance design is completed, it is necessary to use simulation tools to verify. Through simulation, it is possible to check the signal integrity, the impedance matching of the transmission line, and possible problems.

6. Impedance matching method

There are three common PCB impedance matching methods: point-to-point matching, global matching, and interlayer matching. These methods achieve impedance matching of the whole circuit board by adjusting the line width and the thickness of the copper layer in the board.

7. Adjust the line layout and line width

In circuit board design, it is necessary to rationally plan the layout and use layering routing to reduce the coupling between boards and signal rebound. At the same time, the most reasonable line width is calculated according to the signal frequency and the characteristic parameters of the circuit board to ensure the impedance match of the circuit board.

The control points in the impedance process of PCB circuit boards include material selection, physical size and layout, differential signal and microstrip line design, ground plane design, impedance design and simulation verification, impedance matching method and line layout and line width adjustment. These control points together ensure the stable transmission of circuit board signals and high-quality signal transmission.