PCSPCB for you to talk about the common defects in PCB circuit? Common PCB defects and their causes. In the manufacturing process of electronic equipment, the quality of PCB is crucial. As a bridge connecting various electronic components, the quality of PCB directly affects the stability and reliability of the entire equipment. However, there are often defects that can affect the performance of the PCB or even lead to the failure of the entire device. Therefore, understanding these common PCB defects and their causes is critical to improving the quality and reliability of electronic devices.
Common PCB defects and their causes
Weld defect
Welding is an important part of the PCB assembly process, and welding defects are one of the most common PCB defects. Here are some common welding defects and their causes:
1. Virtual welding: Virtual welding means that the welding point is not completely melted or the welding is not strong, resulting in a gap between the welding points. The cause of virtual welding may be that the welding temperature is not high enough, the welding time is not enough, or the welding material is not matched.
2. Pad falling off: pad falling off means that the connection between the pad and the PCB is disconnected, which may be due to high temperature or too long time during the welding process, resulting in excessive heat and falling off the pad.
3. Welding short circuit: Welding short circuit refers to the accidental connection between two or more welding points, which may be caused by too much welding material, too close between welding points or improper welding technology.
Substrate defect
The substrate is the basic structure of the PCB, and its quality directly affects the overall performance of the PCB. Here are some common substrate defects and their causes:
1. Substrate warping: substrate warping refers to the phenomenon of bending or distortion of the substrate during the production process, which may be caused by uneven substrate materials, improper heat treatment or production process problems.
2. Substrate cracks: substrate cracks refer to cracks on the surface or inside of the substrate, which may be caused by poor quality of the substrate material, excessive mechanical stress during the production process or too high heat treatment temperature.
3. Substrate bubbles: substrate bubbles refer to the phenomenon of air or gas encapsulation inside the substrate, which may be caused by the failure to completely volatilization of the volatile components in the substrate material and improper control of the production process.
Line defect
The circuit is an important part of the conductive part of the PCB, and the circuit defect will directly affect the performance and stability of the circuit. Here are some common wiring defects and their causes:
1. Line break: line break means that the line is broken at a certain position, causing the current to fail to pass, which may be caused by line corrosion, mechanical damage or production process problems.
2. Line short circuit: Line short circuit refers to the accidental connection between two or more lines, which may be caused by unreasonable line design, improper production process control or external factors interference.
Hole defect
The hole is an important element on the PCB for connecting the conductive parts of different layers, and the quality of the hole also directly affects the performance and reliability of the PCB. Here are some common hole defects and their causes:
1. Hole wall copper layer fracture: hole wall copper layer fracture refers to the phenomenon of fracture or damage of the copper layer on the inner wall of the hole, which may be caused by excessive mechanical stress during the drilling process, uneven plating in the hole or too high heat treatment temperature. ,
2. Residue in the hole: Residue in the hole refers to the debris or impurities left in the hole during the drilling process, which may be caused by improper control of the drilling process, incomplete cleaning or poor maintenance of the drilling equipment.
In order to avoid these common PCB defects, the procurement personnel of electronic equipment manufacturers need to choose a reliable quality PCB supplier, and carry out strict quality control on the production and processing of PCB. At the same time, the existing defects need to be repaired or replaced in time to ensure the stability and reliability of the device. By understanding and preventing these common PCB defects, we can improve the quality and reliability of electronic devices and provide a better user experience.
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