The machining process of PCB buried blind holes is a complex process, involving multiple steps and technologies. The following is a detailed explanation of the PCB buried blind hole processing process.
1. Preparation
Before you start making a buried blind PCB, you need to do some preparatory work. This includes selecting the right materials and making a detailed production plan. For example, you need to determine whether you are using dual or multi-layer panels and whether you need to go through a thickening copper plating process.
2. Material preparation
According to the production plan, the copper-clad plate is cut and the photosensitive plate is used to make the circuit board. The copper-clad sheet is then pretreated to prepare it for the subsequent manufacturing steps.
3. Transfer circuit board
Next, the circuit design is transferred to the copper-clad plate by means of transfer printing. This process is usually done using a UV exposure machine.
4. Corrode circuit boards
Corrosion is an important step in circuit board fabrication. In this step, chemicals are used to etch the copper-clad plate to form the desired circuit pattern. It should be noted that the corrosion process needs to control the time and temperature to avoid damage to the circuit.
5. Drill holes into the PCB
PCB drilling is one of the key steps in making PCB with buried blind holes. In this process, a drill machine is used to drill through and blind holes in the board. It should be noted that the precision of drilling directly affects the quality and performance of the circuit board.
6. Perforated plate plating
Perforated plate plating refers to electroplating in drilled holes to ensure sufficient metal coating on both the inside and outside of the holes. This process is essential to improve the corrosion resistance and electrical conductivity of the circuit board.
7. Drawing is lead-tin plated
Lead-tin plating is a pre-processing step in circuit board fabrication. In this process, the surface of the circuit board is coated with a layer of lead tin alloy to improve its oxidation resistance and weldability.
8. PCB etching
Etching is the last major process in circuit board manufacture. In this process, chemicals are used to corrode the circuit board, which has been coated with solder resistance, to form the final circuit pattern.
After all the manufacturing steps are completed, a series of checks are carried out on the circuit board to ensure that its quality meets the standard. This includes visual inspection, dimensional measurement, electrical testing and functional testing.
The above is the basic processing process of the buried blind PCB circuit board. It should be noted that the specific production methods and steps may vary depending on the design of the board and the technical requirements required. In actual operation, it should be adjusted and improved according to the specific situation.
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