PCB metal sinking process and tin spraying process are two different surface treatment technologies in the electronics industry, which have a wide range of applications in electronic assembly, PCB manufacturing and other fields. We will explain the difference between the two processes.
1. Gold sinking process
1.1. Principle of gold sinking process
Gold sinking process is a surface treatment technology that forms a gold film on the surface of a metal by means of chemical gold plating. The basic principle is to immerse the metal substrate in a solution containing gold salts, and deposit gold atoms on the surface of the metal through a chemical reaction to form a uniform, dense gold film.
1.2. Characteristics of gold sinking process
(1) Good electrical conductivity: gold has excellent electrical conductivity, and the electrical conductivity of the metal surface after gold deposition is significantly improved.
(2) Good corrosion resistance: gold has high chemical stability and is not easy to be oxidized or corroded, and the metal surface after gold deposition has good corrosion resistance.
(3) Good weldability: gold has good weldability, and the metal surface after sinking gold is easy to weld, and the welding quality is high.
(4) Good wear resistance: the gold film has a high hardness, and the wear resistance of the metal surface after gold deposition is improved.
(5) Good decoration: the gold film has a golden luster, and the metal surface after sinking gold has a good decorative effect.
1.3. Application range of gold sinking process
Gold sinking process is widely used in electronic assembly, PCB manufacturing, connector manufacturing and other fields. In electronic assembly, the metal sinking process is often used for the surface treatment of gold fingers, connectors and other parts. In PCB manufacturing, the metal sinking process is often used for the surface treatment of solder pads, lines and other parts; In connector manufacturing, the metal sinking process is often used for surface treatment of contacts, terminals and other components.
1.4. Advantages and disadvantages of gold sinking process
(1) Advantages:
Good electrical conductivity, corrosion resistance, weldability and wear resistance, suitable for electronic equipment with high reliability requirements.
The high hardness of the gold film can improve the wear resistance of the metal surface.
The gold film has a golden luster and has a good decorative effect.
(2) Disadvantages:
Gold resources are limited and the cost is high.
The process of sinking gold has some pollution to the environment, and it needs to be strictly environmental protection treatment.
2. Tin spraying process
2.1. Principle of tin-spraying process
Tin spray process is a surface treatment technology that forms a tin film on the metal surface by physical vapor deposition. The basic principle is to heat the tin material to a molten state, and then spray it onto the surface of the metal substrate through high-speed air flow to form a uniform, dense tin film.
2.2. Characteristics of tin-spraying process
(1) Good electrical conductivity: Tin has good electrical conductivity, and the electrical conductivity of the metal surface after spraying tin is improved.
(2) Good weldability: tin has good weldability, the metal surface after spraying tin is easy to weld, and the welding quality is high.
(3) Good corrosion resistance: tin film has a certain corrosion resistance, but not as good as gold film.
(4) Low cost: Tin resources are relatively rich and the cost is low.
(5) Good decoration: the tin film has a silver-white luster, and the metal surface after spraying tin has a certain decorative effect.
2.3. Application range of tin-spraying process
Tin spraying process is widely used in electronic assembly, PCB manufacturing, connector manufacturing and other fields. In electronic assembly, tin-spraying process is often used for surface treatment of pads, lines, etc. In PCB manufacturing, tin spraying process is often used for the surface treatment of solder pads, lines and other parts; In connector manufacturing, the tin-spraying process is often used for surface treatment of contacts, terminals and other components.
2.4. Advantages and disadvantages of tin-spraying process
(1) Advantages:
Tin resources are relatively abundant and the cost is low.
The process of tin-spraying has less pollution to the environment and better environmental performance.
Tin film has good solderability and electrical conductivity, and is suitable for electronic equipment with general reliability requirements.
The tin film has a silver-white luster and has a certain decorative effect.
(2) Disadvantages:
The corrosion resistance of tin film is not as good as that of gold film, which is suitable for occasions with lower environmental requirements.
The hardness of tin film is low, and the wear resistance is poor.
3. The difference between gold sinking process and tin spraying process
(1) The material is different: the gold sinking process uses a gold material, while the tin spraying process uses a tin material.
(2) The cost is different: the cost of gold materials is high, and the cost of gold sinking process is relatively high; The cost of tin material is low, and the cost of tin spraying process is relatively low.
(3) Corrosion resistance is different: gold film has high chemical stability, corrosion resistance is better than tin film.
(4) Different wear resistance: gold film has higher hardness, wear resistance is better than tin film.
(5) Different electrical conductivity: gold and tin have good electrical conductivity, but the electrical conductivity of gold is slightly better than that of tin.
(6) Different weldability: gold and tin both have good weldability, but the weldability of gold is slightly better than that of tin.
(7) Different decoration: the gold film has a golden gloss, and the tin film of the tin spray process has a silver-white gloss, and the decorative effect of the two is different.
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