PCSPCB for you to talk about SMT proofing small batch processing process is what? The role of the process edge in SMT proofing processing. In the field of electronic equipment manufacturing, PCBA chip processing technology as the core link, its accuracy and efficiency are directly related to the quality and cost of products. Below we explore in depth the important role of the process edge in SMT proofing small batch processing.
A. Definition and background of process edge
In SMT proofing small batch processing, the process edge refers to the long blank edge on the PCB board to assist the SMT patch, DIP plug-in and welding processing. The process edge usually does not contain any electronic components, and the main purpose is to leave the track transmission position and place the Mosaic MARK point to ensure the smooth progress of the processing.
On the SMT line, the PCB board is transported by rail to various processing sites such as solder paste presses, placement machines and reflow furnaces. Due to the design limitations of the machine equipment, such as the working range of the patch machine nozzle and the width of the guide rail, the PCB board edge must maintain a certain component free area, that is, the process edge. This design not only avoids collision between the machine and components, but also ensures processing accuracy and production efficiency.
B. the role of the process edge
1. Ensure smooth processing process
The process edge provides the necessary transfer space for the PCB board, ensuring the smooth progress of the processing process. Especially in high-speed automated production lines, the process edge can effectively reduce the downtime caused by mechanical interference and improve the overall production efficiency.
2. Prevent component damage
When the SMT mounter is working, the nozzle will mount the components precisely to the specified position on the PCB board. If the edge of the PCB board is too close to the track, the components may collide with the mechanical parts during the mounting process, resulting in damage or mounting failure. The setting of the process edge effectively avoids this situation and protects the integrity of the components.
3. Improve machining accuracy
The process edge not only provides a stable transmission basis for the PCB board, but also facilitates the precise positioning of the PCB board by the machine and equipment. By setting a MARK point at the edge of the process, the SMT equipment can accurately identify the position and orientation of the PCB board, thus achieving high-precision mounting operations.
4. Enhance the mechanical strength of PCB board
The process edge plays an important role in enhancing the mechanical strength of PCB boards. During processing and transportation, PCB boards may be subjected to various external shocks and vibrations. The process edge can effectively disperse these external forces, reduce the deformation and warping of the PCB board, and ensure the stability and reliability of electronic components.
5. Protect the edge of the circuit board
The edge of the PCB board is the area most vulnerable to the impact of the external environment. In harsh working environments, such as high temperature, humidity, etc., the exposed edge of the circuit board may be eroded and damaged. The setting of process edge can effectively protect the edge of the circuit board, reduce the risk of damage caused by the external environment, and extend the service life of the equipment.
C. Design and implementation steps of process edge
Design principle
1. Suitable width: the width of the process edge should be determined according to the actual processing needs and equipment characteristics. Generally speaking, the width is more common between 5-8mm, but the specific value needs to be considered according to the size of the PCB board, component layout and processing equipment limitations.
2. Reasonable location: the process edge is usually set on the long side or both sides of the PCB board in order to leave enough space for the transmission track and processing equipment. At the same time, it should be avoided to set the process edge in the area of dense components, so as not to affect the processing accuracy and efficiency.
3. Clear MARK: When the mark point is set at the edge of the process, it should be ensured that its position is accurate and marked clearly. This helps SMT equipment to quickly and accurately identify the position and direction of the PCB board, improving processing accuracy and efficiency.
Implementation steps
1. Determine the width and position of the process edge: determine the width and position of the process edge according to the size of the PCB board, the layout of components and the limitations of the processing equipment.
2. PCB layout design: Add process edge elements to the PCB layout design, and set clear MARK points.
3. Make PCB board: Make PCB board according to the designed layout, and ensure that the width and position of the process edge meet the design requirements.
4. Processing test: In the SMT proofing small batch processing process, the PCB board with the process edge is tested to verify whether the processing accuracy and efficiency meet the requirements.
D. Optimization and improvement of process edge
1. Make up operation
In order to reduce the production cost and improve the utilization rate of materials, it can be used to simplify the design of the process edge. By combining a number of small PCB boards into a large board for processing, the number and area of process edges can be greatly reduced, thereby reducing production costs. At the same time, the patchwork operation also helps to improve the processing efficiency and accuracy.
2. Automatic process edge
After completing the SMT proofing small batch processing, it is necessary to remove the process edge on the PCB board. The traditional methods of edging include manual edging, V-cut splitter and milling splitter. In order to improve production efficiency and reduce costs, automated deprocessing equipment and technology can be introduced. These devices and technologies can quickly and accurately remove process edges, reduce manual intervention and error, and improve product quality and production efficiency.
3. Intelligent management
With the development and application of intelligent manufacturing technology, the field of PCBA patch processing has also ushered in a wave of intelligent transformation. Through the introduction of intelligent management system and Internet of Things technology, real-time monitoring and data analysis of the whole process of process design, processing and testing can be realized. This helps to discover and solve problems in time, improve production efficiency and product quality, and reduce production costs and risks.
In SMT proofing small batch processing, the process edge as an important part of auxiliary processing, its role can not be ignored. Through reasonable design and implementation of the process edge strategy, it can ensure the smooth progress of the processing process, improve the processing accuracy and efficiency, protect the edge of components and circuit boards, and enhance the mechanical strength of the PCB board. Understanding and mastering the role of process edge and its related knowledge will help improve the accuracy and effectiveness of procurement decisions, and contribute to the production and development of enterprises.
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