1. a simple laminated pcb board (a laminated 6-layer PCB board, laminated structure is (1+4+1)) This type of board is the simplest, that is, the internal multi-layer circuit board has no buried holes, a pressing is completed, although it is a laminated board, its manufacturing is very similar to the conventional multi-layer circuit board a lamination, Only the subsequent and multi-layer circuit board is different from the need for laser drilling blind holes and other processes. Since this laminated structure has no buried holes, then in the production, the second and third layers can be made into a core board, the fourth and fifth layers as another core board, the outer layer is added with a medium layer and copper foil, and the middle is added with a medium layer after pressing together, which is very simple and the cost is lower than the conventional one time laminated board.
2. the conventional single-layer HDI circuit board (single-layer HDI circuit board 6-layer PCB board, stacked into a structure of (1+4+1)) the structure of this type of board is (1+N+1), (N≥2,N even), this structure is the mainstream design of the industry's single-layer board, the multi-layer board has buried holes, the need for secondary pressing to complete. This type of primary laminated board, in addition to the blind hole circuit board, there are buried holes, if the designer can convert this type of HDI circuit board into the above type 1 simple primary laminated board, it is beneficial to both supply and demand. Several of our customers, on our advice, preferred to change the lamination structure of Type 2 conventional primary laminate to a simple primary laminate similar to type 1.
3. the conventional secondary stacking HDI circuit board (secondary stacking HDI 8-layer board, stacked into a structure of (1++1+4+1+1 +1+1)) the structure of this type of board is (1+1+N+1+1), (N≥2,N even), this structure is the mainstream design of the industry secondary stacking, the internal multi-layer board has buried holes, the need for three times to complete the pressing. The main reason is that there is no overlapping hole design and the production difficulty is normal. If the buried hole optimization of (3-6) layer can be changed to the buried hole of (2-7) layer as mentioned before, one pressing can be reduced, the process can be optimized and the cost can be reduced. This type is like the following example.
4. another kind of conventional secondary lamination HDI printed board (secondary lamination HDI 8-layer board, stacked into a structure of (1+1+4+1+1 +1)) such a plate structure (1+1+N+1+1 +1), (N≥2,N even), although it is a secondary lamination board structure, but because the location of the buried hole is not between (3-6) layers, But in the (2-7) layer, such a design can also reduce the pressing once, so that the HDI plate with two layers, the need for three times the pressing process, optimized for two times the pressing process. And this kind of plate, there is another difficult to make, there are (1-3) layers of blind holes, divided into (1-2) layers and (2-3) layers of blind holes to make, it is necessary to fill the inner blind holes of (2-3) layers with holes, that is, the inner blind holes of secondary stacking are made with hole filling process, usually this kind of HDI cost of making hole filling process. It is higher than the cost of not making the hole filling process, and the difficulty is obviously larger, so the conventional secondary laminate, in the design process, it is recommended not to use the overlapping design as much as possible, and try to convert the (1-3) blind holes into staggered (1-2) blind holes and (2-3) buried (blind) holes. Some sophisticated designers can use this refuge to simplify the design or optimization and reduce the manufacturing cost of their products.
5. another unconventional secondary laminated HDI circuit board (secondary laminated HDI 6-layer pcb board, stacked into a structure of (1+1+2+1+1 +1)) such board structure (1+1+N+1+1 +1), (N≥2,N even), although it is a secondary laminated board structure, but there are cross-layer blind holes, the depth of blind holes increased significantly. The blind hole depth of the (1-3) layer is double that of the conventional (1-2) layer, and the customers of this design have their unique requirements, which do not allow the (1-3) cross-layer blind holes to be made into overlapping blind holes (1-2) (2-3) blind holes. In addition to the difficulty of laser drilling, the subsequent copper deposition (PTH) and electroplating are also one of the difficulties. Generally, there is no certain level of technical PCB manufacturers, it is difficult to make such board, the production difficulty is obviously much higher than the conventional secondary laminate, this design is not recommended, except for special requirements.
6. blind hole overlapping design of the secondary layer of HDI, buried holes (2-7) layer above the blind hole overlapping. (Secondary stacking HDI 8-layer pcb board, stacked into a structure of (1+1+4+1+1 +1)) The structure of this type of board is (1+1+N+1+1), (N≥2,N even), this structure is the current industry part of the secondary stacking board has such a design, the internal multi-layer board has buried holes, the need for secondary pressing to complete. The main feature of this design is that blind holes need to be stacked above (2-7) buried holes, which increases the difficulty of production. The buried holes are designed at (2-7) layers, which can reduce one lamination, optimize the process and achieve the effect of reducing costs.
7. cross-layer blind hole design of the secondary laminate HDI (secondary laminate HDI 8 layers, stacked into a structure of (1+1+4+1+1 +1)) the structure of this type of plate is (1+1+N+1+1), (N≥2,N even), this structure is the current industry has a certain difficulty in the production of secondary laminate board, such design, The inner multilayer plate has buried holes in the (3-6) layer and requires three times of pressing to complete. It is mainly a cross-layer blind hole design, which is difficult to make, and HDI PCB manufacturers without certain technical ability are difficult to make such secondary laminates. If this cross-layer blind hole (1-3) layer is optimized to split into (1-2) and (2-3) blind holes, this method of splitting blind holes is not the overlapping hole splitting method mentioned in the fourth and sixth points above. It is staggered blind hole splitting method, which will greatly reduce the production cost and optimize the production process.
8. other laminated structure of HDI board optimization three times laminated printed board or more than three times laminated PCB board, according to the design concept provided above, the same can be optimized, complete three times laminated HDI board, the entire complete production process, it needs to be 4 times pressed, If we can consider the design ideas similar to the above single-laminated panels or double-laminated panels, the production process of single-laminated panels can be completely reduced, thus improving the composition of the panels.
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