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Board Layer
1 Layer
2 Layers
4 Layers
6 Layers
8 Layers
Material
Rolled Copper
Electrolytic Copper
Thickness
0.1 mm
0.13 mm
0.2 mm
0.23 mm
0.32 mm
Surface Treatment
Immersion Gold
Hard Gold Plating
Nickel-Palladium-Gold
Min Track/Spacing
6/6mil
5/5mil
4/4mil
3/3mil
Min Hole Size
0.3mm
0.25mm
0.2mm
0.15mm
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